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Volumn 45, Issue 2, 2004, Pages 300-302
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Behavior of Superficial Oxide Film at Solid-State Diffusion-Bonded Interface of Tin
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Author keywords
Microstructure; Oxide film; Solid state diffusion bonding; Tin
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Indexed keywords
ALUMINUM ALLOYS;
ARGON;
BONDING;
HYDROCHLORIC ACID;
INCLUSIONS;
INTERFACES (MATERIALS);
MICROSTRUCTURE;
RECRYSTALLIZATION (METALLURGY);
SCANNING ELECTRON MICROSCOPY;
SOLDERING;
TENSILE STRENGTH;
TRANSMISSION ELECTRON MICROSCOPY;
OXIDE FILMS;
SOLID-STATE DIFFUSION BONDING;
TIN;
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EID: 1942476896
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.45.300 Document Type: Article |
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Times cited : (11)
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References (7)
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