Hardening and softening in AlSi1 bond contacts during ultrasonic wire bonding

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 4, 2009, Pages 794-799

  Geißler, Ute ^a   Schneider Ramelow, Martin ^b   Reichl, Herbert ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

AlSi1; Dynamic recrystallization; Interface; Microhardness; Softening and hardening; Ultrasonic wedge wedge bonding

Indexed keywords

ALSI1; BOND CONTACT; BONDING TIME; COLD WORKED; DEFORMATION CURVES; DYNAMIC PROCESS; GRAIN SIZE; GRAIN STRUCTURES; INTERFACE; PREDEFORMED; RECRYSTALLIZATIONS; SOFTENING AND HARDENING; ULTRASONIC ENERGY; ULTRASONIC WIRE BONDING; WEDGE BONDING; WIRE BONDING;

GRAIN SIZE AND SHAPE; HARDENING; MICROHARDNESS; PHASE INTERFACES; ULTRASONICS; WIRE;

DYNAMIC RECRYSTALLIZATION;

EID: 72149083838     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2009930     Document Type: Article

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