Effects of particle size of fiberglass-resin powder from PCBs on the properties and volatile behavior of phenolic molding compound

Journal of Hazardous Materials

Volumn 175, Issue 1-3, 2010, Pages 165-171

  Guo, Jie ^a   Rao, Qunli ^a   Xu, Zhenming ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Phenolic molding compound; Printed circuit board; Thermogravimetric analysis

Indexed keywords

DIELECTRIC STRENGTHS; FLEXURAL STRENGTH; HEAT DEFLECTION TEMPERATURE; LOW LEVEL; MOLDING COMPOUND; MOLDING POWDER; NOTCHED IMPACT STRENGTH; PHENOLIC MOLDING COMPOUND; RESIN POWDERS; THERMAL DEGRADATIONS; THERMAL STABILITY; VOLATILE BEHAVIORS; VOLATILE COMPOUNDS; WASTE PRINTED CIRCUIT BOARD; WEIGHT LOSS; WOOD FLOUR;

BIODEGRADATION; GLASS FIBERS; IMPACT STRENGTH; MOLDING; PHENOLIC RESINS; PHENOLS; PRINTED CIRCUIT MANUFACTURE; RESINS; SHEET MOLDING COMPOUNDS; THERMOGRAVIMETRIC ANALYSIS; WOOD PRODUCTS;

PRINTED CIRCUIT BOARDS;

GLASS FIBER; PHENOL DERIVATIVE; RESIN;

DEFLECTION; DEGRADATION; PARTICLE SIZE; PHENOLIC COMPOUND; RESIN; THERMOGRAVIMETRY;

ARTICLE; DEGRADATION KINETICS; ENVIRONMENTAL RECLAMATION; PARTICLE SIZE; SHEAR STRENGTH; THERMOGRAVIMETRY; THERMOSTABILITY; VOLATILIZATION;

GASES; GLASS; HOT TEMPERATURE; MATERIALS TESTING; MICROSCOPY, ELECTRON, SCANNING; MODELS, CHEMICAL; PARTICLE SIZE; PHENOL; POLYCHLORINATED BIPHENYLS; POWDERS; PRESSURE; TEMPERATURE; TENSILE STRENGTH; THERMOGRAVIMETRY;

BIODEGRADATION; GLASS FIBERS; GRAVIMETRY; IMPACT STRENGTH; MOLDING; PHENOL GROUPS; PRINTED CIRCUITS; SYNTHETIC POLYMERS; WOOD PRODUCTS;

EID: 72049130545     PISSN: 03043894     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jhazmat.2009.09.144     Document Type: Article

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