Effects of processing parameters on the bond strength of Cu/Cu roll-bonded strips

Journal of Materials Processing Technology

Volumn 210, Issue 3, 2010, Pages 560-563

  Abbasi, Mohsen ^a   Toroghinejad, Mohammad Reza ^a  

^a ISFAHAN UNIVERSITY OF TECHNOLOGY   (Iran)

Author keywords

Cold roll bonding; Copper; Peel strength

Indexed keywords

BOND STRENGTH; COLD ROLL BONDING; INITIAL THICKNESS; LAYERED COMPOSITES; MECHANICAL CLEANING; PEEL STRENGTH; PEELING STRENGTH; PEELING TEST; PROCESS PARAMETERS; PROCESSING PARAMETERS; ROLLING REDUCTION; ROLLING SPEED; ROLLING TEMPERATURE; SOLID-PHASE METHOD; STRIP-WIDTHS; TWO LAYERS;

BOND STRENGTH (CHEMICAL); BOND STRENGTH (MATERIALS); CHEMICAL CLEANING; DISSIMILAR METALS; SURFACE PROPERTIES; SURFACE ROUGHNESS;

ROLL BONDING;

EID: 72049111254     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2009.11.003     Document Type: Article

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