Hybrid co-packaged receiver module with pin-photodiode chip and DEMUX-IC for 107 Gb/s data rates

European Conference on Optical Communication, ECOC

Volumn , Issue , 2009, Pages

  Mekonnen, G G ^a   Bach, H G ^a   Kunkel, R ^a   Schubert, C ^a   Pech, D ^a   Rosin, T ^a   Konczykowska, A ^b   Jorge, F ^b   Scavennec, A ^b   Riet, M ^b  

^a FRAUNHOFER HEINRICH HERTZ INSTITUTE   (Germany)

^b ALCATEL THALES III V LAB   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DATA RATES; EYE DIAGRAMS; RECEIVER MODULES;

DEMULTIPLEXING; OPTOELECTRONIC DEVICES; PHOTONICS;

OPTICAL COMMUNICATION;

EID: 71949112528     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. J. H. Sinsky et al., Proc. OFC'07, PDP30.
2. G. G. Mekonnen et al., Proc. ECOC'08, Vol. 3-33, We.1.C.5.
3. H.-G. Bach et al., Proc. OFC'09, OMK2.
4. www.ist-gibon.eu and www.hecto.eu
5. A. Konczykowska et al., IEEE Trans. on MTT, Vol. 53, No. 4, pp. 1228-1234.