메뉴 건너뛰기




Volumn 59, Issue 22, 2005, Pages 2832-2837

Copper injection molding using a thermoplastic binder based on paraffin wax

Author keywords

Copper; Debinding; Metal injection molding; Powder technology; Sintering

Indexed keywords

AGGLOMERATION; COOLING; HARDENING; INJECTION MOLDING; METALLURGY; MIXING; PARAFFIN WAXES; PRESSURE EFFECTS; RHEOLOGY; SINTERING; THERMAL CONDUCTIVITY; THERMOPLASTICS; VISCOSITY;

EID: 22144440522     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2005.04.027     Document Type: Article
Times cited : (80)

References (6)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.