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Volumn 59, Issue 22, 2005, Pages 2832-2837
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Copper injection molding using a thermoplastic binder based on paraffin wax
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Author keywords
Copper; Debinding; Metal injection molding; Powder technology; Sintering
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Indexed keywords
AGGLOMERATION;
COOLING;
HARDENING;
INJECTION MOLDING;
METALLURGY;
MIXING;
PARAFFIN WAXES;
PRESSURE EFFECTS;
RHEOLOGY;
SINTERING;
THERMAL CONDUCTIVITY;
THERMOPLASTICS;
VISCOSITY;
DEBINDING;
METAL INJECTION MOLDING;
POWDER TECHNOLOGY;
THERMAL DEBINDING;
COPPER;
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EID: 22144440522
PISSN: 0167577X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.matlet.2005.04.027 Document Type: Article |
Times cited : (80)
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References (6)
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