Pressure stable thermoelectric flow sensors by means of membrane perforation

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2009, Pages 1130-1133

  Kropp, M ^a   Kutzner, C ^b   Hartgenbusch, N ^a   Gu, S ^a   Sosna, C ^a   Buchner, R ^a   Hauptmann, P ^b   Lang, W ^a  

^a UNIVERSITY OF BREMEN   (Germany)

^b OTTO VON GUERICKE UNIVERSITY   (Germany)

Author keywords

Flow sensor; Membrane perforation; Pressure stable

Indexed keywords

BACK PRESSURES; FABRICATION PROCESS; FLOW SENSOR; FLOW-SENSORS; HIGH TEMPERATURE; LIQUID FLOW; PRESSURE STABILITY; SIMULATION RESULT;

ACTUATORS; FARM BUILDINGS; MEMBRANES; MICROSYSTEMS; PIEZOELECTRIC TRANSDUCERS;

SOLID-STATE SENSORS;

EID: 71449127352     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2009.5285929     Document Type: Conference Paper

References (6)

1. M. Ashauer, H. Scholz, R. Briegel, H. Sandmaier, W. Lang, "Thermal Flow Sensors for Very Small Flow Rate," Tech. Digest. 11th Int. Conf. On Solid-state Sensors and Actuators, Munich, Germany, June 10-14, 2001
2. N.T. Nguyen, R. Kiehnscherf, "Low-cost silicon sensors for mass flow measurement of liquids and gases", Sens. & Act., A49, pp. 17-20, 1995
3. Yong Yan, "Mass flow measurement of bulk solids in pneumatic pipelines", Meas. Sci. Technol., 7 (1996), pp. 1687-1706, 1996
4. F. Mayer, M.R, Hornung, R. Steiner Vanna, United States Patent, Patent No.: US 6,813,944 B2, 2004
5. R. Buchner, M. Maiwald, C. Sosna, T. Schary, W. Benecke, W. Lang, "Miniaturised Thermal Flow Sensors for rough Environments", Proceedings of the 19th IEEE International Conference on Micro Electro Mechanical Systems - Technical Digest - MEMS '06" pp. 582-585, 2006
6. R. Buchner, K. Rohloff, W. Lang, W. Benecke, "A High-Temperature thermopile fabrication process for thermal flow sensors" Tech. Transducers'05, June 6.-9., 2005, pp. 575-578