Examining internal gas compositions of a variety of microcircuit package types and ages with a focus on sources of internal moisture

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7206, Issue , 2009, Pages

  Lowry, R K ^a   Kullberg, R C ^a  

^a Oneida Research Services Inc   (United States)

Author keywords

Corrosion; Failure modes; Hermeticity; Leaks; Microelectronic packages; Moisture; Outgassing; Permeation

Indexed keywords

CORROSION FAILURES; DATA SETS; FAILURE MECHANISM; GAS COMPOSITIONS; HERMETICITY; HOLD UP; LEAKS; MICROCIRCUIT PACKAGES; MICROELECTRONIC PACKAGE; MOISTURE CONCENTRATION; PRIMARY SOURCES;

CORROSION; DEGASSING; ENCLOSURES; LEAKAGE (FLUID); MICROELECTRONICS; MOISTURE; NANOSTRUCTURED MATERIALS; PACKAGING; QUALITY ASSURANCE; SAFETY FACTOR;

FAILURE ANALYSIS;

EID: 71449083795     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.807970     Document Type: Conference Paper

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