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Applied Physics Letters

Volumn 95, Issue 18, 2009, Pages

Terahertz vacuum electronic circuits fabricated by UV lithographic molding and deep reactive ion etching

(6) Shin, Young Min a Barnett, Larry R a Gamzina, Diana a Luhmann, Neville C a Field, Mark b Borwick, Robert b

a UNIVERSITY OF CALIFORNIA (United States)

b ROCKWELL SCIENTIFIC COMPANY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEEP REACTIVE ION ETCHING; DIMENSIONAL TOLERANCE; DISPERSION PROPERTIES; EIGEN MODES; FABRICATION TOLERANCES; MICRO ELECTRO MECHANICAL SYSTEM; OPERATION MODE; TE MODE; TERA HERTZ; TRANSIENT SIMULATION; UV LITHOGRAPHY; VACUUM ELECTRONICS;

ATOMIC FORCE MICROSCOPY; ELECTRIC NETWORK ANALYSIS; ELECTRON TUBES; FABRICATION; FITS AND TOLERANCES; MEMS; MICROELECTROMECHANICAL DEVICES; MOLDING; REACTIVE MOLDING; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; VACUUM; VACUUM APPLICATIONS;

REACTIVE ION ETCHING;

EID: 71049162224 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.3259823 Document Type: Article

Times cited : (104)

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