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Volumn , Issue , 2009, Pages 868-871

Nanoclay-filled epoxy composites for electrical insulation applications

Author keywords

Breakdown; Epoxy; Microstructure; Nanoclay; Nanocomposite; Permittivity; Toughness

Indexed keywords

BREAKDOWN; BREAKDOWN STRENGTHS; BULK SAMPLES; CRACK DEFLECTIONS; ELECTRICAL DAMAGE; ELECTRICAL INSULATION; EPOXY; EPOXY COMPOSITE; FRACTURE PROPERTY; INSULATION APPLICATIONS; MICROSCOPY TECHNIQUE; NANO CLAYS; NANOCLAY; PERMITTIVITY AND LOSS; TOUGHENING MECHANISMS; X-RAY DIFFRACTION TECHNIQUES;

EID: 71049126592     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICPADM.2009.5252226     Document Type: Conference Paper
Times cited : (9)

References (14)
  • 1
    • 0003393935 scopus 로고
    • Their Applications and Technology. McGraw-Hill
    • Lee, H. &Neville, K. (1957) in Epoxy Resins. Their Applications and Technology. McGraw-Hill.
    • (1957) Epoxy Resins
    • Lee, H.1    Neville, K.2
  • 9
    • 71049130684 scopus 로고    scopus 로고
    • Guevara Morales, A. (2007) MSc thesis, Imperial College London
    • Guevara Morales, A. (2007) MSc thesis, Imperial College London.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.