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Volumn , Issue , 2009, Pages 868-871
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Nanoclay-filled epoxy composites for electrical insulation applications
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Author keywords
Breakdown; Epoxy; Microstructure; Nanoclay; Nanocomposite; Permittivity; Toughness
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Indexed keywords
BREAKDOWN;
BREAKDOWN STRENGTHS;
BULK SAMPLES;
CRACK DEFLECTIONS;
ELECTRICAL DAMAGE;
ELECTRICAL INSULATION;
EPOXY;
EPOXY COMPOSITE;
FRACTURE PROPERTY;
INSULATION APPLICATIONS;
MICROSCOPY TECHNIQUE;
NANO CLAYS;
NANOCLAY;
PERMITTIVITY AND LOSS;
TOUGHENING MECHANISMS;
X-RAY DIFFRACTION TECHNIQUES;
MICROSTRUCTURE;
NANOCOMPOSITES;
NANOSTRUCTURED MATERIALS;
PERMITTIVITY;
DIELECTRIC MATERIALS;
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EID: 71049126592
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ICPADM.2009.5252226 Document Type: Conference Paper |
Times cited : (9)
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References (14)
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