Smart card assembly requires advanced pre-assembly methods

Semiconductor International

Volumn 23, Issue 8, 2000, Pages

  Müller, Jochen ^a,c   Stampka, Peter ^a,d   Kröninger, Werner ^a,c,e,f   Gaulhofer, Ernst ^b,f,g   Oyrer, Heinz ^b,f  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b SEZ AG   (Austria)

^c UNIVERSITY OF REGENSBURG   (Germany)

^d SIEMENS AG   (Germany)

^e Frauenhofer Institut (ISC)   (Germany)

^f Rodenstock Precision Optics ^*  (Austria)

^g AMS AG   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

COARSE GRINDING; DIE BONDING; FINE GRINDING; PRESSURE SENSITIVE TAPE; SMART CARD ASSEMBLY; SPIN ETCHING TECHNOLOGY; ULTRAVIOLET TAPE; WIRE BONDING;

ADHESION; ENCAPSULATION; ETCHING; FLIP CHIP DEVICES; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SMART CARDS; TAPES; THICKNESS CONTROL;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 84866834237     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

1. Masters Thesis, A. Mueller-Hipper, University of Regensburg, 1999.
2. IEEE, Smart Card Technologies and Applications, Workshop, Berlin, 1998.
3. J.C. McLaughlin, A. F. Willoughby, "Fracture of Silicon Wafers," J. of Crystal Growth, 85, 1987, p. 83.
4. K. Yasutake, M. Iwata, "Crack Heeling and Fracture Strength of Silicon Crystals." J. of Materials Science, 21, 1986, p. 2185.
5. W. Rankl, W. Effing, Handbuch der Chipkarten, Hanser, Munich, 3. edition, 1999.
6. H. Houdeau, P. Stampka, F. Püschner, Die moderne Chipkarte - Anforderungen und Lösungen, Galvanotechnik, Jahrbuch der dt Gesellschaft für Oberflächentechnik, 1998.
7. Dünne Chips für Minigehäuse, Markt&Technik, 50, 1999, p. 47.
8. Cheryl McHatton, Cynthia M. Gumbert, "Defects Caused by Mechanical Backgrinding of Wafers and their Elimination by Wet Chemical Etching," Solid State Technology, November 1998.
9. U S. Patent 5,967,578
10. "The Importance of Measuring Cumulative Film Stresses and its Relationship to Wafer Backgrinding. Characterizing Process Interactions," ADE Corp. Application Note, No D3010, 1993.