Board level reliability assessments of thru-mold via package on package (TMV™ PoP)

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 1124-1129

  Hwang, Tae Kyung ^a   Park, Dong Joo ^a   Kim, Jin Seong ^a   Kim, Jin Young ^a   Kim, Jae Dong ^a   Lee, Choon Heung ^a  

^a Amkor Technology Korea Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; BOARD-LEVEL RELIABILITY; ELECTRONIC TECHNOLOGIES; GENERATION TECHNOLOGIES; MATRIX; MEMORY DEVICE; PACKAGE LEVELS; QUALIFICATION TEST; SEMICONDUCTOR ASSEMBLY;

ELECTRONICS PACKAGING; LASER ABLATION; RELIABILITY ANALYSIS; TECHNOLOGY;

PACKAGING;

EID: 70450061005     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270597     Document Type: Conference Paper

References (5)

1. Zwenger, C. et al., "Next Generation Package-on-Package (PoP) Platform with Through Mold Via (TMV™) Interconnection Technology," Proc IMAPS Device Packaging Conference, Scottsdale, AZ, March 2009.
2. th Electroni Components & Technology Conference, Orlando, FL, May 2008.
3. Zwenger, C. et al., "Surface mount assembly and board level reliability for high density PoP utilizing through mold via interconnection technology," Proc SMTA International Conference, Orlando, FL, August 2008.
4. JEDEC JESD22-A104C, "Temperature Cycling".
5. JEDEC JESD22-B111, "Board Level Drop Test Method of Components for Handheld Electronic Products".