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Volumn 42, Issue 11, 1998, Pages 2031-2040

Heat transfer efficiency of metal honeycombs

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COOLING; HEAT SINKS; HONEYCOMB STRUCTURES; LAMINAR FLOW; MATHEMATICAL MODELS; MORPHOLOGY; OPTIMIZATION; PRESSURE DROP; REYNOLDS NUMBER; TURBULENT FLOW;

EID: 0032105413     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0017-9310(98)00306-8     Document Type: Article
Times cited : (202)

References (14)
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    • Hexcel Co., Pleasanton, CA
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  • 2
    • 0032083888 scopus 로고    scopus 로고
    • Heat transfer in opencell metal foams
    • TJ. Lu, H.A. Stone, M.F. Ashby, Heat transfer in opencell metal foams, Acta mater. 46 (1998) 3619-3635.
    • (1998) Acta Mater. , vol.46 , pp. 3619-3635
    • Lu, T.J.1    Stone, H.A.2    Ashby, M.F.3
  • 4
    • 0012631680 scopus 로고    scopus 로고
    • Evaluation of cellular metal heat dissipation media, Harvard University, Division of Engineering and Applied Sciences
    • Cambridge, MA 02138, U.S.A., 1998, to be published
    • A.F. Bastawros, A.G. Evans, H.A. Stone, Evaluation of cellular metal heat dissipation media, Harvard University, Division of Engineering and Applied Sciences Report MECH-325, Cambridge, MA 02138, U.S.A., 1998, to be published.
    • Report MECH-325
    • Bastawros, A.F.1    Evans, A.G.2    Stone, H.A.3
  • 6
    • 0032166541 scopus 로고    scopus 로고
    • The effects of material properties on heat dissipation in high power electronics, Trans. ASME
    • in press
    • TJ. Lu, A.G. Evans, J.W. Hutchinson, The effects of material properties on heat dissipation in high power electronics, Trans. ASME, J. Electronic Packaging, 1998 in press.
    • (1998) J. Electronic Packaging
    • Lu, T.J.1    Evans, A.G.2    Hutchinson, J.W.3
  • 8
    • 0000593623 scopus 로고
    • Developing laminar flow and heat transfer in the entrance region of regular polygonal ducts
    • Y. Asako, H. Nakamura, M. Faghri, Developing laminar flow and heat transfer in the entrance region of regular polygonal ducts, Int. J. Heat Mass Transfer 31 (1988) 2590-2593.
    • (1988) Int. J. Heat Mass Transfer , vol.31 , pp. 2590-2593
    • Asako, Y.1    Nakamura, H.2    Faghri, M.3
  • 10
    • 0003397084 scopus 로고
    • McGraw-Hill Book Company, New York
    • J.P. Holman, Heat Transfer, McGraw-Hill Book Company, New York, 1989.
    • (1989) Heat Transfer
    • Holman, J.P.1
  • 11
    • 0026220409 scopus 로고
    • Optimal thermal design of forced convection heat sinks-analytical
    • R.W. Knight, J.S. Goodling, DJ. Hall, Optimal thermal design of forced convection heat sinks-analytical, ASME J. Electronic Packaging 113 (1991) 313-321.
    • (1991) ASME J. Electronic Packaging , vol.113 , pp. 313-321
    • Knight, R.W.1    Goodling, J.S.2    Hall, D.J.3
  • 12
    • 0027003957 scopus 로고
    • The optimal spacing of parallel plates cooled by forced convection
    • A. Bejan, E. Sciubba, The optimal spacing of parallel plates cooled by forced convection, Int. J. Heat Mass Transfer 35 (1992) 329-364.
    • (1992) Int. J. Heat Mass Transfer , vol.35 , pp. 329-364
    • Bejan, A.1    Sciubba, E.2
  • 13
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    • Comments on the optimal spacing of parallel plates cooled by forced convection
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  • 14
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    • Comparison of several heat transfer enhancement technologies for gas heat exchangers
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    • Andrews, M.J.1    Fletcher, L.S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.