On-package magnetic materials for embedded inductor applications

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 471-474

  Li, Liangliang ^a   Lee, Dok Won ^b   Hwang, Kyu Pyung ^c   Min, Yongki ^c   Wang, Shan X ^b  

^a TSINGHUA UNIVERSITY   (China)

^b Stanford University   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALTERNATIVE PROCESS; EMBEDDED INDUCTORS; EMERGING APPLICATIONS; HIGH QUALITY FACTORS; KERR MICROSCOPY; LOW RESISTANCE; MICROWAVE COMMUNICATIONS; OVER THE AIRS; PERMEABILITY SPECTRUM; POWER DELIVERY SYSTEMS; QUALITY OPTIMIZATION; SAND BLASTING; SYSTEM-ON-PACKAGE APPLICATIONS;

BLASTING; CAPILLARITY; CHIP SCALE PACKAGES; CUSTOMER SATISFACTION; ELECTRIC POWER TRANSMISSION; HYSTERESIS; HYSTERESIS LOOPS; INDUCTANCE; MAGNETIC CIRCUITS; MAGNETIC CORES; MAGNETIC DEVICES; MAGNETIC DOMAINS; MAGNETIC PROPERTIES; PACKAGING; PRINTED CIRCUIT MANUFACTURE; WET ETCHING;

PRINTED CIRCUIT BOARDS;

EID: 70449944913     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270707     Document Type: Conference Paper

References (12)

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