Small-resistance and high-quality-factor magnetic integrated inductors on PCB

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 4, 2009, Pages 780-787

  Li, Liangliang ^a,b   Lee, Dok Won ^a   Hwang, Kyu Pyung ^c   Min, Yongki ^c   Hizume, Toru ^d   Tanaka, Masato ^d   Mao, Ming ^e   Schneider, Thomas ^e   Bubber, Randhir ^e   Wang, Shan X ^a  

^a Stanford University   (United States)

^b TSINGHUA UNIVERSITY   (China)

^c INTEL CORPORATION   (United States)

^d SHINKO ELECTRIC INDUSTRIES CO LTD   (Japan)

^e VEECO INSTRUMENTS INC   (United States)

Author keywords

High frequency simulation; Magnetic integrated inductor; Permeability; Printed circuit board

Indexed keywords

AIR CORE INDUCTORS; DC RESISTANCE; EXPERIMENTAL DATA; FREQUENCY RANGES; FUTURE DIRECTIONS; HFSS SIMULATION; HIGH FREQUENCY HF; HIGH FREQUENCY PERFORMANCE; HIGH QUALITY FACTORS; INTEGRATED INDUCTORS; MAGNETIC INDUCTORS; MAGNETIC INTEGRATED INDUCTOR; PERMEABILITY SPECTRUM; POWER DELIVERY; QUALITY FACTORS; SIMULATION RESULT;

CAPILLARITY; ELECTRIC INDUCTORS; ELECTRIC POWER TRANSMISSION; INDUCTANCE; MAGNETIC CIRCUITS; MAGNETIC DEVICES; MAGNETIC MATERIALS; MAGNETISM; PRINTED CIRCUIT MANUFACTURE; Q FACTOR MEASUREMENT;

PRINTED CIRCUIT BOARDS;

EID: 74649085978     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2019845     Document Type: Article

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