A new low cost, elastic and conformable electronics technology for soft and stretchable electronic devices by use of a stretchable substrate

2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

  Bossuyt, F ^a   Vervust, T ^a   Axisa, F ^a   Vanfleteren, J ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

Ambient electronics; Biomedical electronic implants; Moulding; PDMS; Polymers; Smart textiles; Stretchable electronics; Stretchable interconnections

Indexed keywords

AMBIENT ELECTRONICS; BIOMEDICAL ELECTRONICS; BODY TISSUES; DAILY LIVES; ELECTRONIC DEVICE; ELECTRONICS TECHNOLOGY; EMERGING TOPICS; LOW COSTS; MANUFACTURABILITY; METALLIC INTERCONNECTIONS; PCB FABRICATION; PROCESS STEPS; RIGID OBJECTS; SMART TEXTILES; STRETCHABLE ELECTRONICS;

CHIP SCALE PACKAGES; ELECTRON DEVICES; FABRICS; FUNCTIONAL POLYMERS; MICROCHANNELS; MICROELECTRONICS; MOLDING; POLYCHLORINATED BIPHENYLS; POLYMERS; PRINTED CIRCUIT BOARDS; SILICONES; TECHNOLOGICAL FORECASTING; TECHNOLOGY TRANSFER; TEXTILE PROCESSING; THERMOELECTRIC EQUIPMENT;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 70449752453     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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