Influence of incident ion beam angle on dry etching of silica sub-micron particles deposited on Si substrates

Thin Solid Films

Volumn 518, Issue 5, 2009, Pages 1543-1548

  Portal, S ^a   Rubio Roy, M ^a   Corbella, C ^a   Vallve M A ^a   Ignes Mullol, J ^a   Bertran, E ^a  

^a UNIVERSITY OF BARCELONA   (Spain)

Author keywords

Dry etching; Langmuir Blodgett technique; Nanopatterning; Silica submicroparticle; Sol gel

Indexed keywords

2-D CRYSTALS; ALKOXIDE PRECURSOR; CLOSE PACKED STRUCTURES; COLLOIDAL CRYSTALS; COLLOIDAL LITHOGRAPHY; ETCHING PROCESS; INCIDENT BEAMS; ION BEAM ANGLE; LANGMUIR BLODGETT TECHNIQUES; LARGE SURFACE AREA; MONOLAYER FILM; NANO-STRUCTURED; NANO-STRUCTURING; NANOPATTERNING; OBLIQUE INCIDENCE; PARTICLE FILMS; PARTICLE LAYER; PHYSICAL SPUTTERING; ROOM TEMPERATURE; SELF-ASSEMBLED; SHADOWING EFFECTS; SI SUBSTRATES; SUB-MICRON PARTICLES; SUBSTRATE ETCHING;

ELECTRON ENERGY LEVELS; GELS; ION BEAMS; IONS; PLASMA ETCHING; SELF ASSEMBLED MONOLAYERS; SEMICONDUCTING SILICON COMPOUNDS; SILICA; SILICON WAFERS; SOL-GEL PROCESS; SOL-GELS; SOLS; SPUTTERING; SUBSTRATES; TWO DIMENSIONAL;

DRY ETCHING;

EID: 70449698475     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.09.077     Document Type: Article

References (34)

1. Sanchez C., Boissière C., Grosso D., Laberty C., and Nicole L. Chem. Mater. 20 (2008) 682
2. Koshida N., and Matsumoto N. Mater. Sci. Eng., R Rep. 40 (2003) 169
3. Mao L., and Ye H. Renew. Energy 35 (2010) 249
4. Dorfner D., Zabel T., Hürlimann T., Hauke N., Frandsen L., Rant U., Abstreiter G., and Finley J. Biosens. Bioelectron. 24 (2009) 3688
5. Lopez C. Adv. Mater. 15 20 (2003) 1679
6. Lin Y., Herman P.R., and Darmawikarta K. Appl. Phys. Lett. 86 (2005) 071117
7. Xia D., Li D., Luo Y., and Brueck S.R.J. Adv. Mater. 18 (2006) 930
8. Shi J., Guo S.S., Sun M.H., Baigl D., and Chen Y. Microelectron. Eng. 84 (2007) 1471
9. Galisteo J.F., Garcia-Santamaria F., Golmayo D., Juarez B.H., Lopez C., and Palacios E. J. Opt. A, Pure Appl. Opt. 7 (2005) S244
10. Deckman H.W., and Dunsmuir J.H. Appl. Phys. Lett. 41 (1982) 377
11. Kosiorek A., Kandulski W., Chudzinski P., Kempa K., and Giersig M. Nano Lett. 4 7 (2004) 1359
12. Yang S.M., Jang S.G., Choi D.G., Kim S., and Yu H.K. Small 2 4 (2006) 458
13. Jiang P. Langmuir 22 (2006) 3955
14. Fredriksson H., Alaverdyan Y., Dmitriev A., Langhammer C., Sutherland D.S., Zäch M., and Kasemo B. Adv. Mater. 19 (2007) 4297
15. Meng T., Zhu M., Pan J., Zhan P., and Wang Z. Jpn. J. Appl. Phys. 47 10 (2008) 8109
16. Sun G., Fang Y., Cong Q., and Ren L. J. Bionic Eng. 6 (2009) 71
17. Khromova I.A., and Melnikov L.A. Opt. Commun. 281 (2008) 5458
18. Champion J.A., Katare Y.K., and Mitragotri S. PNAS 104 29 (2007) 11901
19. Sacanna S., Rossi L., Kuipers B.W.M., and Philipse A.P. Langmuir 22 (2006) 1822
20. Reculusa S., Poncet-Legrand C., Perro A., Duguet E., Bourgeat-Lami E., Mingotaud C., and Ravaine S. Chem. Mater. 17 (2005) 3338
21. Lu Y., Yin Y., and Xia Y. Adv. Mater. 13 4 (2001) 271
22. Hosein I.D., and Liddell C.M. Langmuir 23 (2007) 10479
23. Brown A.B.D., Smith C.G., and Rennie A.R. Phys. Rev. E 62 1 (2000) 951
24. Snoecks E., Van Blaaderen A., Van Dillen T., Van Kats C.M., Brongersma M.L., and Polman A. Adv. Mater. 12 20 (2000) 1511
25. Snoecks E., Van Blaaderen A., Van Dillen T., Van Kats C.M., Velikov K., Brongersma M.L., and Polman A. Nucl. Instr. and Meth. in Phys. Res. B 178 (2001) 62
26. Van Dillen T., Snoecks E., Fukarek W., Van Kats C.M., Velikov K.P., Van Blaaderen A., and Polman A. Nucl. Instr. and Meth. in Phys. Res. B 175-177 (2001) 350
27. Velikov K.P., Van Dillen T., Polman A., and Van Blaaderen A. Appl. Phys. Lett. 81 5 (2002) 838
28. Liu Y., Zhao Z., Chen Y., Lan D., and Wang Y. Nucl. Instr. and Meth. in Phys. Res. B 266 (2008) 894
29. Stöber W., Fink A., and Bohn E. J. Colloid Interface Sci. 26 (1968) 62
30. Boukari H., Long G.G., and Harris M.T. J. Colloid Interface Sci. 229 (2000) 129
31. Rubio-Roy M., Bertran E., Pascual E., Polo M.C., and Andújar J.L. Diamond Relat. Mater. 17 (2008) 1728
32. Portal S., Vallvé M.A., Arteaga O., Ignes-Mullol J., Canillas A., and Bertran E. Thin Solid Films 517 (2008) 1053
33. Lieberman M.A., and Lichtenberg A.J. Principles of Plasma Discharges and Materials Processing. 2ond edition (2005), Wiley 310 chapter 9.3
34. Barklund A.M., and Blom H.O. J. Vac. Sci. Technol., A, 11 4 (1993) 1226