Copper ECD process of ULSI circuits controlled by electroanalysis combined with multi-way chemometrics. Transfer of the PARAFAC/ILS calibration

ECS Transactions

Volumn 16, Issue 22, 2009, Pages 11-26

  Jaworski, A ^a   Wikiel, H ^a   Wikiel, K ^a  

^a YesTech Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION MODEL; CALIBRATION TRANSFER; CHEMOMETRICS; CHIP-MANUFACTURING; CONCENTRATION MONITORING; CONCENTRATION PREDICTION; COST MINIMIZATION; CRITICAL COMPONENT; DAMASCENE PROCESSING; ELECTRONIC COMPONENT; IN-SITU; INSTRUMENT STANDARDIZATION; MULTICOMPONENTS; ON-LINE MONITORING SYSTEM; PLATING BATH; PLATING SOLUTIONS; PROCESS SPECIFICATION; REAL-TIME ANALYZERS; SECONDARY SYSTEM; VOLTAMMETRIC TECHNIQUES;

CALIBRATION; ELECTROCHEMICAL SENSORS; ELECTROCHROMIC DEVICES; ELECTRONICS PACKAGING; ELECTROPLATING; REDUCTION; ULSI CIRCUITS;

PROCESS CONTROL;

EID: 70449686413     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3115645     Document Type: Conference Paper

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