Changes of UV optical properties of plasma damaged low-k dielectrics for sidewall damage scatterometry

Materials Research Society Symposium Proceedings

Volumn 1079, Issue , 2008, Pages 156-161

  Marsik, Premysl ^a,b   Urbanowicz, Adam ^a   Vinokur, Klara ^c   Cohen, Yoel ^c   Baklanov, Mikhail R ^a  

^a MEC   (Belgium)

^b MASARYK UNIVERSITY   (Czech Republic)

^c NOVA   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIA; CHLORINE COMPOUNDS; DIELECTRIC MATERIALS; ETCHING; FILM PREPARATION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MICROELECTRONICS; OPTICAL MULTILAYERS; OPTICAL PROPERTIES; SECONDARY ION MASS SPECTROMETRY; SILICON COMPOUNDS; SILICON WAFERS; SPECTROSCOPIC ELLIPSOMETRY; THIN FILMS;

ATOMIC CONCENTRATION; CHEMICAL COMPOSITIONS; ELLIPSOMETRIC POROSIMETRY; OPTICAL MODELING; PLASMA TREATMENT; PORE INTERCONNECTIVITY; POROUS LOW-K DIELECTRICS; VARIABLE ANGLE SPECTROSCOPIC ELLIPSOMETRY;

LOW-K DIELECTRIC;

EID: 70350602396     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-1079-n07-04     Document Type: Conference Paper

References (7)

1. D. Shamiryan et al, J. Vac. Sci. Technol. B 20 (5) (2002)
2. P. Marsik et al., Phys. Stat. Sol. (c), accepted (2008)
3. S. Eslava et al., J. Electrochem. Soc., accepted (2008)
4. A. Zaka, unpublished IMEC 2007
5. M. R. Baklanov, K. P. Mogilnikov, Microelectron. Eng., 64, 335 (2002)
6. P. Marsik, in preparation 2008
7. A. Grill, D. A. Neumayer, J. Appl. Phys., 94, 10, 6697 (2003)