Effect of lead-free soldering on key material properties of FR-4 printed circuit board laminates

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 32, Issue 4, 2009, Pages 272-280

  Sanapala, Ravikumar ^a   Sood, Bhanu ^a   Das, Diganta ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

FR 4; Glass transition temperature; Halogen free; Lead free soldering; Printed circuit board (PCB)

Indexed keywords

ASSEMBLY CONDITION; BEFORE AND AFTER; COEFFICIENT OF THERMAL EXPANSION; COMBINATORIAL PROPERTIES; CURING AGENTS; DECOMPOSITION TEMPERATURE; DICYANDIAMIDE; FR-4; GLASS TRANSITION TEMPERATURE; HALOGEN-FREE; HIGHER TEMPERATURES; KEY MATERIALS; LAMINATE MATERIALS; LEAD-FREE SOLDERING; MATERIAL PROPERTY; SELECTION PROCESS; SNPB SOLDER; SOLDER ALLOYS; TEST METHOD;

FLAME RETARDANTS; GLASS; GLASS TRANSITION; HALOGEN ELEMENTS; LAMINATES; LEAD; MATERIALS PROPERTIES; PHENOLS; PRINTED CIRCUIT MANUFACTURE; SOLDERING; SOLDERING ALLOYS; SUPERCONDUCTING TRANSITION TEMPERATURE; THERMAL EXPANSION; WATER ABSORPTION;

PRINTED CIRCUIT BOARDS;

EID: 70350348650     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2009.2029566     Document Type: Article

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