The influence of curing systems on epoxide-based PCB laminate performance

Circuit World

Volumn 31, Issue 4, 2005, Pages 14-20

  Peng, Yih Rern ^a   Qi, Xiaolong ^a   Chrisafides, Christos ^b  

^a Grace Electron Corporation   (China)

^b ROHM AND HAAS COMPANY   (United States)

Author keywords

Epoxy resins; Laminates; Printed circuit boards

Indexed keywords

ADHESION; AROMATIC COMPOUNDS; CURING; ELECTRONICS INDUSTRY; EPOXY RESINS; HEAT RESISTANCE; PAPER LAMINATES; PRINTED CIRCUIT MANUFACTURE; WATER ABSORPTION;

AROMATIC RING STRUCTURE; CIRCUIT BOARD INDUSTRY; CURING SYSTEMS; EPOXIDE-BASED LAMINATE PERFORMANCE; PREPREG MATERIALS; PROCESSABILITY;

PRINTED CIRCUIT BOARDS;

EID: 26444464780     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120510603099     Document Type: Review

References (3)

1. Gu, X.S. (2001), Copper Clad Laminate for Print Circuit Board, Chemical Industry Publishing Company, Beijing.
2. Sun, M.L. and Wu, L.Y. (2002), The Principle and Technology of Epoxy Resin Applications, Mechanical Industry Publishing Company, Beijing.
3. Wang, D.Z. (2001), Production and Application of Epoxy Resin, Chemical Industry Publishing Company, Beijing.