A computational design methodology for assembly and actuation of thin-film structures via patterning of eigenstrains

Journal of Microelectromechanical Systems

Volumn 18, Issue 5, 2009, Pages 1137-1148

  Howard, Micah ^a   Pajot, Joe ^a,b   Maute, Kurt ^a   Dunn, Martin L ^a  

^a UCB 450   (United States)

^b ALTAIR ENGINEERING   (United States)

Author keywords

Design methodology; Microelectromechanical devices; Patterning; Thin film

Indexed keywords

3D STRUCTURES; BIFURCATION POINTS; BUCKLING DEFORMATION; COMPLEX DEFORMATION; COMPUTATIONAL APPROACH; COMPUTATIONAL DESIGN; CONTINUUM FORMULATION; DESIGN METHODOLOGY; EIGENSTRAINS; EXTENDED SYSTEMS; GEOMETRICALLY NONLINEAR; INSTABILITY POINTS; INTERNAL STRESS; MATERIAL LAYOUT; PATTERNING; POSTBUCKLING RESPONSE; STRESS-FREE STRAINS; THIN-FILM STRUCTURE; TOPOLOGY OPTIMIZATION;

CONTINUUM MECHANICS; DEFORMATION; DESIGN; FILM PREPARATION; MICROELECTROMECHANICAL DEVICES; MULTILAYERS; STRUCTURAL OPTIMIZATION; THIN FILM DEVICES; THREE DIMENSIONAL;

MULTILAYER FILMS;

EID: 70349985729     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2009.2025562     Document Type: Article

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