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Volumn 289-292, Issue , 2009, Pages 95-100
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Grain boundary diffusion of Ni in ultra-fine grain copper-lead alloy produced by equal channel angular pressing
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Author keywords
Copper; Copper alloy; Equal channel angular pressing; Grain boundary diffusion; Non equilibrium grain boundary
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Indexed keywords
BINARY ALLOYS;
COPPER;
COPPER ALLOYS;
DIFFUSION;
EQUAL CHANNEL ANGULAR PRESSING;
GRAIN BOUNDARIES;
GRAIN SIZE AND SHAPE;
NICKEL;
PRESSING (FORMING);
GRAIN-BOUNDARY DIFFUSION;
INTERNAL INTERFACES;
KINETIC CHARACTERISTICS;
MECHANICAL SECTIONING;
NON-EQUILIBRIUM GRAIN BOUNDARIES;
RADIOTRACER TECHNIQUES;
TEMPERATURE DIFFUSION;
ULTRAFINE GRAINED MATERIALS;
LEAD ALLOYS;
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EID: 70349801087
PISSN: 10120386
EISSN: 16629507
Source Type: Journal
DOI: 10.4028/www.scientific.net/DDF.289-292.95 Document Type: Conference Paper |
Times cited : (8)
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References (18)
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