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Volumn 289-292, Issue , 2009, Pages 95-100

Grain boundary diffusion of Ni in ultra-fine grain copper-lead alloy produced by equal channel angular pressing

Author keywords

Copper; Copper alloy; Equal channel angular pressing; Grain boundary diffusion; Non equilibrium grain boundary

Indexed keywords

BINARY ALLOYS; COPPER; COPPER ALLOYS; DIFFUSION; EQUAL CHANNEL ANGULAR PRESSING; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NICKEL; PRESSING (FORMING);

EID: 70349801087     PISSN: 10120386     EISSN: 16629507     Source Type: Journal    
DOI: 10.4028/www.scientific.net/DDF.289-292.95     Document Type: Conference Paper
Times cited : (8)

References (18)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.