The over-bump applied resin wafer-level underfill process: Process, material and reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1502-1505

  Feger, Claudius ^a   LaBianca, Nancy ^a   Gaynes, Michael ^a   Steen, Steven ^a   Liu, Zhen ^b   Peddi, Raj ^b   Francis, Mark ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b HENKEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRITICAL STEPS; FLIP-CHIP PACKAGES; HIGH TEMPERATURE STORAGE; SHAPE AND SIZE; TEST VEHICLE; UNDERFILL PROCESS; UNDERFILLS; WAFER LEVEL;

AUTOMOBILE PARTS AND EQUIPMENT; ELECTRIC BATTERIES; HIGH TEMPERATURE SUPERCONDUCTORS; SOLDERING ALLOYS;

RESINS;

EID: 70349677330     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074211     Document Type: Conference Paper

References (13)

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