The effect of filler on the solder connection for no-flow underfill

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 479-484

  Kawamoto, Satomi ^a   Suzuki, Osamu ^a   Abe, Yukinari ^a  

^a NAMICS CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FILLERS; FLIP CHIP DEVICES; INTERFACES (MATERIALS); SEMICONDUCTOR MATERIALS; SHEAR STRENGTH; SILICA; SOLDERING;

FLIP CHIP BONDERS (FCB); NO-FLOW UNDERFILL (NUF) PROCESS; SILICA FILLERS; SOLDER CONNECTION;

ELECTRONICS PACKAGING;

EID: 33845580890     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645690     Document Type: Conference Paper

References (1)

1. S. Kawamoto and O. Suzuki, "No-flow underfill for lead free packages", ICEP, pp33-37, April, 2005