A review of the critical heat flux condition in mini-and microchannels

Journal of Mechanical Science and Technology

Volumn 23, Issue 9, 2009, Pages 2529-2547

  Roday, Anand P ^a   Jensen, Michael K ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Boiling; Critical heat flux; Dryout; Heat transfer coefficient

Indexed keywords

BOILING; BOILING HEAT TRANSFER; CONVECTIVE VAPORIZATION; COOLING APPLICATIONS; CRITICAL HEAT FLUX; DRYOUT; ELECTRONIC CHIPS; FORCED AIR COOLING; GEOMETRIC CONDITIONS; INFLUENCING FACTOR; OPERATIONAL LIMITS; PHENOMENOLOGICAL MODELS; POWER DISSIPATION; SINGLE-PHASE LIQUIDS;

COOLING; HEAT EXCHANGERS; HEAT TRANSFER COEFFICIENTS; MICROCHANNELS; TABLE LOOKUP;

HEAT FLUX;

EID: 70349669132     PISSN: 1738494X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s12206-009-0711-y     Document Type: Review

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