Hybrid optical interconnection module with built-in electrical power line for mobile phone using highly-flexible integrally-formed OE-FPC

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 2101-2105

  Uemura, Hiroshi ^a   Hamasaki, Hiroshi ^a   Furuyama, Hideto ^a   Numata, Hideo ^a   Takubo, Chiaki ^a   Shibata, Hideki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL POWER; ELECTROMAGNETIC NOISE; FLIP-CHIP BONDING; HIGH PRODUCTIVITY; HIGH-SPEED; HIGH-SPEED SIGNALS; LOW RESISTANCE; OPTICAL INTERCONNECTION MODULE; OPTICAL SIGNAL TRANSMISSION; POWER SUPPLY; SPEED SIGNAL;

ELECTRIC LINES; ELECTRIC POWER SUPPLIES TO APPARATUS; FLIP CHIP DEVICES; MOBILE PHONES; OPTICAL COMMUNICATION; OPTICAL INSTRUMENTS; OPTICAL INTERCONNECTS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; TELECOMMUNICATION LINES; TELEPHONE; TELEPHONE SETS;

LIGHT TRANSMISSION;

EID: 70349657158     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074315     Document Type: Conference Paper

References (7)

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