Extremely-compact and high-performance (160Gbps = 20GB/s) optical semiconductor module using lead frame embedded optoelectronic ferrule

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1936-1940

  Uemura, Hiroshi ^a   Hamasaki, Hiroshi ^a   Furuyama, Hideto ^a   Numata, Hideo ^a   Takubo, Chiaki ^a   Shibata, Hideki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS;

20 GB/S; ELECTRONIC COMPONENTS; OPTICAL-;

POWDERS;

EID: 51349131564     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550247     Document Type: Conference Paper

References (5)

1. Pham. D et al., "The Design and Implementation of a First-Generation CELL Processor", Digest of Technical Papers. ISSCC., (2005), pp. 184-185
2. Rumbus Developer forum Japan 2007, Tokyo, Japan, Nov. 2007
3. H. Hamasaki et al, "An Ultra High Performance 1Tbps bandwidth Optoelectronic LSI Package using Post-reflow Optical-interface Stacking Technique", IMAPS 40th International Symposium on Microelectronics, (2007), pp. 87-93
4. W. Sakurai, et al, "A Novel Optoelectronic Ferrule and Easy Ribbon Fiber Splicer for Cost-effective Optical Interconnection", Electronic Packaging Technology Conference, (2006), pp. 367-372
5. H. Hamasaki, et al., "Novel Optoelectronic LSI Packaging Suitable for Standard FR-4 Printed Wiring Board with Bandwidth Capability of Over 1Tbps", Electronic Components and Technology Conference, (2006), pp. 298-302