Packaging characteristics of 6-layer ultra low-k/Cu dual damascene interconnect featuring advanced scalable porous silica (k=2.1)

Proceedings of the 2009 IEEE International Interconnect Technology Conference, IITC 2009

Volumn , Issue , 2009, Pages 110-112

  Chikaki, S ^a   Soda, E ^a   Gawase, A ^a   Suzuki, T ^b   Kawashima, Y ^c   Oda, N ^a   Saito, S ^a  

^a SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC   (Japan)

^b Sumitomo Bakelite Co Ltd ^*  (Japan)

^c RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CYCLE TESTS; DUAL DAMASCENE INTERCONNECT; DUAL-DAMASCENE INTERCONNECTS; HIGH-ADHESION; LOW-K FILMS; MULTI LEVEL INTERCONNECTS; PACKAGING PERFORMANCE; POROUS SILICA; WIREBONDING;

OPTICAL INTERCONNECTS;

SILICA;

EID: 70349473210     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090355     Document Type: Conference Paper

References (4)

1. J. Nakahira et al, AMC 2007 pp.545-549, 2008 MRS
2. M. Ueki et al, Tech. Digest IEDM2008, pp.619-622
3. N. Oda et al, Tech. Digest IEDM2008, pp.615-618
4. S. Chikaki et al., Tech. Digest IEDM2007, pp.969-972