Reliability failure modes in interconnects for the 45 nm technology node and beyond

Proceedings of the 2009 IEEE International Interconnect Technology Conference, IITC 2009

Volumn , Issue , 2009, Pages 179-181

  Arnaud, L ^a,b   Galpin, D ^b   Chhun, S ^b   Monget, C ^b   Richard, E ^b   Roy, D ^b   Besset, C ^b   Vilmay, M ^b   Doyen, L ^b   Waltz, P ^b   Petitprez, E ^b   Terrier, F ^b   Imbert, G ^b   Le Friec, Y ^b  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

45NM NODE; 45NM TECHNOLOGY; INTERCONNECT MATERIALS; PROCESS INTEGRATION; RELIABILITY FAILURE; ROBUST RELIABILITY; SURFACE QUALITIES; WORK ANALYSIS;

ELECTRON BEAM LITHOGRAPHY; NANOTECHNOLOGY; QUALITY ASSURANCE; RELIABILITY ANALYSIS;

FAILURE ANALYSIS;

EID: 70349441100     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090381     Document Type: Conference Paper

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