A 4-side tileable back illuminated 3d-integrated Mpixel CMOS image sensor

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn , Issue , 2009, Pages

  Vyshnavi, Suntharalingam ^a   Robert, Berger ^a   Stewart, Clark ^b   Jeffrey, Knecht ^a   Andrew, Messier ^a   Kevin, Newcomb ^a   Dennis, Rathman ^a   Richard, Slattery ^a   Antonio, Soares ^a   Charles, Stevenson ^a   Keith, Warner ^a   Douglas, Young ^a   Lin, Ping Ang ^c   Barmak, Mansoorian ^c   David, Shaver ^a  

^a MIT LINCOLN LABORATORY   (United States)

^b Irvine Sensors   (United States)

^c Forza Silicon Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 70349280620     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2009.4977296     Document Type: Conference Paper

References (5)

1. K.B. Cho et al., "A 1/2.5 inch 8.1Mpixel CMOS Image Sensor for Digital Cameras,"ISSCC Dig. Tech. Papers, pp. 508-509, Feb. 2007.
2. N. Kaiser, "Pan-STARRS: a Wide-Field Optical Survey Telescope Array," Proc. SPIE, vol. 5489, pp. 11-22, Oct. 2004.
3. J.L. Tonry et al., "Results from the Pan-STARRS Orthogonal Transfer Array (OTA),"Proc. SPIE, vol. 7021, 702105, July 2008.
4. V. Suntharalingam et al., "Megapixel CMOS Image Sensor Fabricated in Three-Dimensional Integrated Circuit Technology," ISSCC Dig. Tech. Papers, pp. 356-357, Feb.2005.
5. D.J. Young et al., "Deep-Trench Process Technology for Three-DimensionallyIntegrated SOI-Based Image Sensors," IEEE Int. SOI Conf., pp. 97-98, Oct. 2007.