Deep-trench process technology for three-dimensionally integrated SOI-based image sensors

Proceedings - IEEE International SOI Conference

Volumn , Issue , 2007, Pages 97-98

  Young, D J ^a   Knecht, J M ^a   Rathman, D D ^a   Warner, K ^a   Yost, D R ^a   Newcomb, K ^a   Suntharalingam, V ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEEP TRENCH PROCESS TECHNOLOGIES; FUNCTIONAL DEVICES; IMAGING DEVICES; IMAGING PIXELS;

IMAGE PROCESSING; IMAGING SYSTEMS; LEAKAGE CURRENTS; PIXELS; SILICON ON INSULATOR TECHNOLOGY;

FOCAL PLANE ARRAYS;

EID: 43549084533     PISSN: 1078621X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SOI.2007.4357870     Document Type: Conference Paper

References (4)

1. V. Suntharalingam et al., 2005 IEEE International Solid-State Circuits Conference Technical Digest, pp. 356-357.
2. J.A. Burns et al., IEEE Trans. Electron Devices, vol. 53, pp. 2507-2516.
3. J.M. Knecht et al., 2005 IEEE International SOI Conference Proceedings, pp. 104-105.
4. B.E. Burke et al., IEEE Trans. Electron Devices, vol. 44, pp. 1633-1642.