Steady and unsteady thermal analysis of a triple stack cold plate with heat losses

International Journal of Numerical Methods for Heat and Fluid Flow

Volumn 15, Issue 1, 2005, Pages 96-112

  Beh, Shiao Lin ^a   Ooi, C K ^b   Quadir, G A ^b   Seetharamu, K N ^b  

^a MULTIMEDIA UNIVERSITY   (Malaysia)

^b SCHOOL OF PHYSICS   (Malaysia)

Author keywords

Cooling; Electronic equipment and components; Finite element analysis; Heat loss

Indexed keywords

ASYMPTOTIC STABILITY; COOLING; ELECTRONIC EQUIPMENT; FINITE ELEMENT METHOD; HEAT CONDUCTION; HEAT LOSSES; HEAT TRANSFER COEFFICIENTS; INCOMPRESSIBLE FLOW; SPECIFIC HEAT; THERMAL CONDUCTIVITY; THERMAL EFFECTS; THERMOANALYSIS; WAVEFORM ANALYSIS;

ASYMPTOTIC WAVEFORM EVALUATION (AWE); ELECTRONIC EQUIPMENT AND COMPONENTS; NUMBER OF UNIT CELLS (NUC); ONE-DIMENSIONAL FIN THEORY;

PLATES (STRUCTURAL COMPONENTS);

THERMAL ANALYSIS;

EID: 13844266193     PISSN: 09615539     EISSN: None     Source Type: Journal    
DOI: 10.1108/09615530510571976     Document Type: Article

References (10)

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