Thermal management integration for microfluidics applications

DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2009, Pages 107-112

  Camps, T ^a,b   Marty, B ^a,b   Tasselli, J ^a,b   Marty, A ^a,b   Lagrange, D ^a,b  

^a LAAS CNRS   (France)

^b UNIVERSITÉ PAUL SABATIER   (France)

Author keywords

[No Author keywords available]

Indexed keywords

MEMS APPLICATIONS; POLYSILICON DIODES; TEMPERATURE VARIATION; THERMAL MANAGEMENT; THERMAL SENSITIVITY; THERMAL SENSORS; THERMAL SOURCE;

MICROFLUIDICS; POLYSILICON;

SENSORS;

EID: 70349208930     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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