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Volumn 54, Issue 27, 2009, Pages 6935-6940

Electrochemical codeposition of copper and manganese from room-temperature N-butyl-N-methylpyrrolidinium bis(trifluoromethylsulfonyl)imide ionic liquid

Author keywords

Bis(trifluoromethylsulfonyl)imide; Cu Mn codeposition; Electrodeposition; Ionic liquid; Room temperature

Indexed keywords

ALLOY COATINGS; ANODIC DISSOLUTION; AQUEOUS SOLUTIONS; BIS(TRIFLUOROMETHYLSULFONYL)IMIDE; CONCENTRATION RATIO; CONTROLLED-POTENTIAL ELECTROLYSIS; COPPER-MANGANESE ALLOY COATINGS; CRYSTALLINE STRUCTURE; CU-MN CODEPOSITION; DEPOSITION POTENTIAL; ELECTROCHEMICAL CODEPOSITION; METALLIC ELECTRODES; OXIDATION CURRENTS; PASSIVE BEHAVIOR; ROOM TEMPERATURE; VOLTAMMETRIC BEHAVIORS;

EID: 69949118483     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2009.07.016     Document Type: Article
Times cited : (40)

References (24)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.