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Volumn 54, Issue 27, 2009, Pages 6935-6940
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Electrochemical codeposition of copper and manganese from room-temperature N-butyl-N-methylpyrrolidinium bis(trifluoromethylsulfonyl)imide ionic liquid
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Author keywords
Bis(trifluoromethylsulfonyl)imide; Cu Mn codeposition; Electrodeposition; Ionic liquid; Room temperature
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Indexed keywords
ALLOY COATINGS;
ANODIC DISSOLUTION;
AQUEOUS SOLUTIONS;
BIS(TRIFLUOROMETHYLSULFONYL)IMIDE;
CONCENTRATION RATIO;
CONTROLLED-POTENTIAL ELECTROLYSIS;
COPPER-MANGANESE ALLOY COATINGS;
CRYSTALLINE STRUCTURE;
CU-MN CODEPOSITION;
DEPOSITION POTENTIAL;
ELECTROCHEMICAL CODEPOSITION;
METALLIC ELECTRODES;
OXIDATION CURRENTS;
PASSIVE BEHAVIOR;
ROOM TEMPERATURE;
VOLTAMMETRIC BEHAVIORS;
ALLOYS;
COATINGS;
DISSOLUTION;
ELECTRODEPOSITION;
ELECTRODES;
IONIC LIQUIDS;
IONIZATION OF LIQUIDS;
IONS;
MANGANESE;
MANGANESE ALLOYS;
MANGANESE COMPOUNDS;
OXIDATION;
SODIUM CHLORIDE;
COPPER ALLOYS;
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EID: 69949118483
PISSN: 00134686
EISSN: None
Source Type: Journal
DOI: 10.1016/j.electacta.2009.07.016 Document Type: Article |
Times cited : (40)
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References (24)
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