Dynamic cure kinetics of epoxy-novolac compounds as studied by differential scanning calorimetry

Journal of Applied Polymer Science

Volumn 114, Issue 4, 2009, Pages 2373-2377

  Yang, Shin Shiao ^a   Hsieh, Tar Hwa ^a   Bi, Hsiaotao T ^b   Ho, Ko Shan ^a   Ho, Tsung Han ^a   Chen, Ho Ruei ^a   Ye, Shi Hao ^a   Chang, Yu Chen ^c  

^a NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^b UNIVERSITY OF BRITISH COLUMBIA   (Canada)

^c NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Curing of polymers; Differential scanning calorimetry (DSC); Thermosets

Indexed keywords

AUTOCATALYTIC; CURE KINETICS; CURED EPOXY; CURING OF POLYMERS; HIGH-CONTENT; KINETIC MODELS; MOLDING COMPOUND; NOVOLAC; PHENOMENOLOGICAL DESCRIPTION; SILICA FILLER;

CALORIMETERS; CURING; MOLDING; PHENOLIC RESINS; SCANNING; SHEET MOLDING COMPOUNDS; SILICA;

DIFFERENTIAL SCANNING CALORIMETRY;

CATALYST; CHEMICAL MODIFICATION; CURING (CHEMISTRY); EPOXY RESIN;

EID: 69949106120     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.29589     Document Type: Article

References (17)

1. Kinjo, N.; Ogata, M.; Nishi, K.; Kaneda, A. Adv Polym Sci 1989, 88, 1.
2. Soane, D. S.; Martynenko, Z. Polymers in Microelectronics; Elsevier: New York, 1989.
3. Wong, C. P. Polymers for Electronic and Photonic Applications; Academic: New York, 1993.
4. Belton, D. J.; Sullivan, E. J Appl Polym 1986, 21, 1309.
5. Belton, D. J.; Molter, M. Polym Eng Sci 1988, 28, 189.
6. Kima, J.; Yooa, S.; Baea, J. Y.; Yunb, H. C.; Hwangb, J.; Kongb, B. S. Polym Degrad Stab 2003, 81, 207.
7. Prime, R. B. Polym Eng Sci 1973, 13, 365.
8. Fritz, D. B.; Wang, C. S. Polymeric Materials for Electronics Packaging and Interconnections; American Chemical Society: Washington, DC, 1989; Chapter 33.
9. Barton, J. M.; Hamerton, L.; Howlin, B. J.; Jones, J. R.; Liu, S. Polymer 1998, 39, 1929.
10. Xu, W. B.; Bao, S. P.; Shen, S. J.; Hang, G. P.; He, P. S. J Appl Polym Sci 2003, 88, 2932.
11. Wang, F.; Xiao, J.; Wang, J. W.; Li, S. Q. J Appl Polym Sci 2008, 107, 223.
12. Hsieh, T. H.; Su, A. C. J Appl Polym Sci 1990, 41, 1271.
13. Hsieh, T. H.; Su, A. C. J Appl Polym Sci 1992, 44, 165.
14. Hsieh, T. H.; Su, A. C. Polym Eng Sci 1999, 39, 1335.
15. Hsieh, T. H.; Wang, T. L.; Ho, K. S.; Wang, Y. Z. Polym Eng Sci 2000, 40, 418.
16. Hsieh, T. H.; Su, A. C. J Polym Res 1994, 1, 313.
17. Kamal, M. R.; Sourour, S. Polym Eng Sci 1973, 13, 59.