Variation in dielectric properties of an epoxy-novolac molding compound during dynamic cure

Polymer Engineering and Science

Volumn 39, Issue 7, 1999, Pages 1335-1343

  Hsieh, T H ^a   Ho, K S ^a  

^a NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIELECTRIC LOSSES; DIELECTRIC RELAXATION; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC POWER FACTOR; ELECTRODES; EPOXY RESINS; IONIC CONDUCTION; NUMERICAL METHODS; PERMITTIVITY; POLARIZATION; THERMAL EFFECTS;

DIELECTROMETRY; ELECTRODE POLARIZATION; EMPIRICAL FUNCTION; EPOXY NOVOLAC MOLDING COMPOUND;

SHEET MOLDING COMPOUNDS;

EID: 0032641011     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.11521     Document Type: Article

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