A facile approach to fabricate Ni inverse opals at controlled thickness

Materials Letters

Volumn 63, Issue 27, 2009, Pages 2393-2395

  Huang, Yi Jui ^a   Lai, Chun Han ^a   Wu, Pu Wei ^a   Chen, Li Yin ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Colloidal crystals; Electrophoretic deposition; Inverse opals; Ni plating

Indexed keywords

COLLOIDAL CRYSTALS; CONDUCTIVE SUBSTRATES; CONTROLLED THICKNESS; CONVENTIONAL APPROACH; ELECTROPHORETIC DEPOSITION; ELECTROPHORETIC DEPOSITION METHODS; INTERSTITIAL VOIDS; INVERSE OPAL; INVERSE OPALS; NI PLATING; PROCESSING PARAMETERS; SELECTIVE REMOVAL; STRUCTURAL STABILITIES; SURFACE UNIFORMITY;

CRYSTAL DEFECTS; CRYSTALS; ELECTROPHORESIS; NICKEL; POLYSTYRENES; STABILITY; SURFACE DEFECTS;

SILICATE MINERALS;

EID: 69849100006     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2009.08.030     Document Type: Article

References (21)

1. Cho G.J., Jung M.H., Yang H.T., Lee B.K., and Song J.H. Mater Lett 61 (2007) 1086-1090
2. Chen S.H., Yuan R., Chai Y.Q., Xu L., Wang N., Li X.N., et al. Electroanalysis 18 (2006) 471-477
3. Hoogenboom J.P., Rétif C., Bres E., Boer M., Langen-Suurling A.K., Romijn J., et al. Nano Lett 4 (2004) 205-208
4. Li Q.Y., Chen Y.F., and Dong P. Mater Lett 59 (2005) 3521-3524
5. Masuda Y., Itoh T., Itoh M., and Koumoto K. Langmuir 20 (2004) 5588-5592
6. Choi W.M., and Park O.O. Nanotechnology 17 (2006) 325-329
7. Napolskii K., Sapoletova N., Eliseev A., Tsirlina G., Rubacheva A., Gańshina E., et al. J Magn Magn Mater 321 (2009) 833-835
8. Song Y.Y., Zhang D., Gao W., and Xia X.H. Chem Eur J 11 (2005) 2177-2182
9. Yu X.D., Lee Y.J., Furstenberg R., White J.O., and Braun P.V. Adv Mater 19 (2007) 1689-1692
10. Napolskii K.S., Sinitskii A., Grigoriev S.V., Grigorieva N.A., Eckerlebe H., Eliseev A.A., et al. Physica B 397 (2007) 23-26
11. Yan H.W., Blanford C.F., Lytle J.C., Carter C.B., Smyrl W.H., and Stein A. Chem Mater 13 (2001) 4314-4321
12. Freymann G.V., John S., Schulz-Dobrick M.T., Vekris E.G., Tétreault N.C., Wong S., et al. Appl Phys Lett 84 (2004) 224-226
13. Luo Q., Liu Z.J., Li L., Xie S.H., Kong J.L., and Zhao D.Y. Adv Mater 13 (2001) 286-289
14. Sokolov S., and Stein A. Mater Lett 57 (2003) 3593-3597
15. Li S., Zheng J.T., Yang W.Y., and Zhao Y.C. Mater Lett 61 (2007) 4784-4786
16. Hao Y.W., Zhu F.Q., Chien C.L., and Searson P.C. J Electrochem Soc 154 (2007) D65-D69
17. Huang Y.J., Lai C.H., and Wu P.W. Electrochem Solid-State Lett 12 (2008) 20-22
18. Reese C.E., and Asher S.A. J Colloid Interface Sci 248 (2002) 41-46
19. Eagleton T.S., and Searson P.C. Chem Mater 16 (2004) 5027-5032
20. Chung Y.W., Leu I.C., Lee J.H., Yen J.H., and Hon M.H. J Electrochem Soc 6 (2007) E77-E83
21. Xia D.Y., Zhang J.G., He X., and Brueck S.R.J. Appl Phys Lett 93 (2008) 071105