SCOPUS 정보 검색 플랫폼

Applied Surface Science

Volumn 255, Issue 6, 2009, Pages 3472-3479

Deposition characteristics of copper particles on roughened substrates through kinetic spraying

(3) Kumar, S a Bae, Gyuyeol a Lee, Changhee a

a Hanyang University (South Korea)

Author keywords

Bond strength; Kinetic spraying; Roughness; Simulation

Indexed keywords

ABAQUS; ALUMINUM; ALUMINUM COATINGS; BOND STRENGTH (MATERIALS); COPPER POWDER; DEFORMATION; DEPOSITION; FINITE ELEMENT METHOD; KINETICS; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS;

CHARACTERISTIC FACTORS; CONTACT TEMPERATURE; DEPOSITION CHARACTERISTICS; INITIAL DEPOSITIONS; KINETIC SPRAY PROCESS; KINETIC SPRAYING; PARTICLE DEFORMATION; SIMULATION;

SUBSTRATES;

EID: 69549103534 PISSN: 01694332 EISSN: None Source Type: Journal
DOI: 10.1016/j.apsusc.2008.10.060 Document Type: Article

Times cited : (64)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.