High-current pulsed vacuum-arc evaporator for surface-alloying technologies

IEEE Transactions on Plasma Science

Volumn 37, Issue 8 SPEC. ISS. PART 1, 2009, Pages 1504-1510

  Popov, Sergy A ^a   Proskurovsky, Dmitry I ^a   Pryadko, Elena L ^a   Batrakov, Alexander V ^a   Markov, Alexy B ^a   Ozur, Grigory E ^a   Rotshtein, Vladimir P ^a  

^a INSTITUTE OF HIGH CURRENT ELECTRONICS   (Russian Federation)

Author keywords

Film deposition; High current reflective discharge; Plasma source; Pulsed vacuum arc evaporator; Surface alloying

Indexed keywords

ARC DISCHARGE; CATHODE SPOT; COPPER FILMS; CURRENT AMPLITUDE; DISCHARGE CELLS; DISCHARGE CURRENTS; DROPLET SPOTS; ENERGY DENSITY; FAVORABLE CONDITIONS; FIELD OPTIMIZATION; FILM DEPOSITION; HIGH-CURRENT; HIGH-CURRENT REFLECTIVE DISCHARGE; ON THE FLIES; PENNING DISCHARGE CELLS; PLASMA COLUMNS; PULSED PLASMA; PULSED VACUUM; PULSED VACUUM-ARC EVAPORATOR; SOURCE MODELS; SURFACE ALLOYING; VACUUM ARCS;

ALLOYING; CAVITY RESONATORS; CELL MEMBRANES; DEPOSITION RATES; DROP FORMATION; EVAPORATION; EVAPORATORS; PLASMA DENSITY; PLASMA DEPOSITION; PLASMA JETS; PLASMA SOURCES; VACUUM; VACUUM DEPOSITION; VACUUM TECHNOLOGY; VAPORS;

ELECTRIC DISCHARGES;

EID: 69249229626     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2009.2024750     Document Type: Conference Paper

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