Analysis of Co/Cu multilayers by SNMS reverse depth profiling

Vacuum

Volumn 84, Issue 1, 2009, Pages 141-143

  Csik, A ^a   Vad, K ^a   Langer, G A ^b   Katona, G L ^b   Toth Kadar E ^a   Peter L ^a  

^a INSTITUTE OF EXPERIMENTAL MEDICINE   (Hungary)

^b UNIVERSITY OF DEBRECEN   (Hungary)

Author keywords

Co Cu multilayers; Electrodeposition; Reverse depth profiling; SNMS

Indexed keywords

CO/CU MULTILAYERS; DEPTH RESOLUTION; EVEN LAYERS; FILM STRUCTURE; HIGH RESOLUTION; IN-DEPTH PROFILING; MULTI-LAYER THIN FILM; NUMBER OF LAYERS; OVERALL QUALITY; REVERSE DEPTH PROFILING; SI SUBSTRATES; SNMS; SPUTTERING TECHNIQUES; SURFACE AND INTERFACES; THIN-FILM STRUCTURE;

CORROSION; ELECTRODEPOSITION; FILM PREPARATION; MULTILAYER FILMS; MULTILAYERS; SUBSTRATES; THIN FILM DEVICES;

DEPTH PROFILING;

EID: 69249215180     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.vacuum.2009.04.066     Document Type: Article

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