On the strain rate sensitivity of the flow stress of ultrafine-grained Cu processed by equal channel angular extrusion (ECAE)

Scripta Materialia

Volumn 53, Issue 5, 2005, Pages 581-584

  Conrad, H ^a   Jung, K ^a  

^a North Carolina State University   (United States)

Author keywords

Cu; Flow stress; Grain boundary shear; Strain rate sensitivity; Ultrafine grain size

Indexed keywords

ACTIVATION ENERGY; COMPUTER SIMULATION; ELASTICITY; ELECTRODEPOSITION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; METAL EXTRUSION; PLASTIC FLOW; SHEAR STRESS; STRAIN RATE; THIN FILMS; VAPOR DEPOSITION;

EQUAL CHANNEL ANGULAR EXTRUSION (ECAE); GRAIN BOUNDARY SHEAR; STRAIN RATE SENSITIVITY; ULTRAFINE GRAIN SIZE;

COPPER;

EID: 20644452237     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2005.04.030     Document Type: Article

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