A fast algorithm for thermal transient multisource simulation using interpolated zth functions

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 2, 2009, Pages 478-483

  Schweitzer, Dirk ^a  

^a Technologies AG   (Germany)

Author keywords

Multichip packages; Multiple heat sources; Thermal transient simulation

Indexed keywords

COMPUTATIONAL COSTS; CONVOLUTION INTEGRALS; CUBIC-SPLINE INTERPOLATION; ELECTRONIC DEVICE; ENERGY-CONSERVING; FAST ALGORITHMS; FINITE ELEMENT SIMULATIONS; MODEL REDUCTION; MULTICHIP-PACKAGES; MULTIPLE HEAT SOURCES; MULTISOURCES; POWER DISSIPATION; POWER PROFILE; SPREADSHEET PROGRAM; STRAIGHT-FORWARD METHOD; TEMPERATURE PROFILES; THERMAL TRANSIENT SIMULATION; THERMAL TRANSIENTS; TRANSIENT THERMAL RESPONSE;

SPLINES; SPREADSHEETS;

ENERGY CONSERVATION;

EID: 68349133297     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2001172     Document Type: Article

References (5)

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