|
Volumn 19, Issue 31, 2009, Pages 5510-5517
|
Coupling of MnZn-ferrite films onto electronic components by a novel solution process for high frequency applications
|
Author keywords
[No Author keywords available]
|
Indexed keywords
COMPOSITE SHEETS;
ELECTRONIC COMPONENT;
FERRITE FILMS;
HIGH RESISTIVITY;
HIGH-FREQUENCY APPLICATIONS;
IC CHIPS;
LOWER LIMITS;
MAGNETIC AND ELECTRICAL PROPERTIES;
MAGNETIC LOSS;
NOISE SUPPRESSION;
NOISE SUPPRESSORS;
NOVEL SOLUTIONS;
OXIDIZING AGENTS;
PH BUFFERS;
POLYIMIDE SUBSTRATE;
POST ANNEALING;
REFLOW--SOLDERING;
CRYSTALLINE MATERIALS;
ELECTRIC PROPERTIES;
FERRITE;
FLIP CHIP DEVICES;
MANGANESE;
MANGANESE COMPOUNDS;
POLYIMIDES;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT MANUFACTURE;
ROTATING DISKS;
SUBSTRATES;
ZINC;
FILM PREPARATION;
|
EID: 68149099002
PISSN: 09599428
EISSN: 13645501
Source Type: Journal
DOI: 10.1039/b903717a Document Type: Article |
Times cited : (13)
|
References (43)
|