Study on the abrasive effecting factors of the removal rate during dual-lapping sapphire wafer

Key Engineering Materials

Volumn 407-408, Issue , 2009, Pages 550-554

  Zhang, Kehua ^a,b   Wen, Donghui ^a   Yuan, Julong ^b  

^a ZHEJIANG UNIVERSITY OF TECHNOLOGY   (China)

^b ZHEJIANG NORMAL UNIVERSITY   (China)

Author keywords

Dual lapping; Materials removal ratio; Sapphire wafer; Surface uniformity

Indexed keywords

SAPPHIRE;

EFFECTING FACTORS; MATERIAL REMOVAL MODE; NATURE OF SURFACE; QUALITATIVE ANALYSIS; REMOVAL RATIOS; SAPPHIRE WAFER; SUB-SURFACE DAMAGE; SURFACE UNIFORMITY;

LAPPING;

EID: 68049137510     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/KEM.407-408.550     Document Type: Article

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