Multilayer photo resist stamps for selective plasma treatment in micrometer scales

Plasma Processes and Polymers

Volumn 6, Issue 4, 2009, Pages 228-233

  Stöhr, Uwe ^a   Dohse, Antje ^b   Hoppe, Paul ^a   Thomas, Michael ^b   Kadel, Klaus ^c   Klages, Claus Peter ^b   Reinecke, Holger ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b FRAUNHOFER INSTITUTE FOR SURFACE ENGINEERING AND THIN FILMS IST   (Germany)

^c Boehringer Ingelheimmicro Parts GmbH   (Germany)

Author keywords

Area selective surface treatment; Dielectric barrier discharge; Monomers; Photoresist; Plasma printing; Plasma stamp

Indexed keywords

AREA-SELECTIVE SURFACE TREATMENT; BIOSCIENCE APPLICATIONS; CARRIER MATERIAL; CAVITY DIMENSION; CHANNEL NETWORK; DIELECTRIC BARRIER DISCHARGE; DIELECTRIC BARRIER DISCHARGES; FLAT SURFACES; HIGH POTENTIAL; MEMS PROCESS; MICROMETER SCALE; PLASMA TREATMENT; PROCESS GAS; PRODUCTION PROCESS; RESIST LAYERS; SUBSTRATE SURFACE;

ATMOSPHERIC PRESSURE; DIELECTRIC DEVICES; ELECTRIC DISCHARGES; FLOW CONTROL; MONOMERS; PHOTORESISTORS; PLASMAS; PRINTING; SUBSTRATES; SURFACE TREATMENT;

PLASMA APPLICATIONS;

EID: 67651208875     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.200800217     Document Type: Article

References (17)

1. H. Tan, T. Akagi, T. Ichiki, J. Photopolym. Sci. Technol. 2006, 19, 245-250. Online. Available: http://dx.doi.org /10.2494/photopolymer.19.245.
2. R. Brandenburg et al., Contrib. Plasma Phys. 2007, 47, 72-79. Online.Available: http://dx.doi.org/10.1002/ ctpp.200710011.
3. M. Noeske, J. Degenhardt, S. Strudthoff, U. Lommatzsch, Int. J. Adhesion Adhesives 2004, 24, 171-177. Online. Available: http://dx.doi.org/10.1016/j.ijadhadh.2003.09.006.
4. C. Penache, C. Gessner, T. Betker, V. Bartels, C.-P. Klages, IEE Proc.-Nanobiotechnol. 2004, 151, 139-144. Online. Available: http://dx.doi.org/10.1049/ip-nbt:20040836.
5. C. Klages et al., Plasma Process. Polym. 2007, 4(3), 208-218. Online. Available: http://dx.doi.org/10.1002/ppap.200600116.
6. N. Lucas, A. Hinze, C.-P. Klages, S. Büttgenbach, J. Phys. D: Appl. Phys. 2008, 41, 194012 (5pp). Online. Available: http://dx.doi.org/10.1088/0022-3727/41/19/194012.
7. B. Langowski, K. Uhrich, Langmuir 2005, 21, 10 509-10 514. Online. Available: http://dx.doi.org/10.1021/la052222m.
8. I. Graz, A. Ebner, S. Bauer, C. Romanin, H. Gruber, Appl. Phys. A 2008, 92, 547-555. Online. Available: http://dx.doi.org/ 10.1007/s00339-008-4614-z.
9. S. Kreitz, C. Penache, M. Thomas, C.-P. Klages, Surf. Coat. Technol. 2005, 200, 676-679. Online. Available: http://dx.doi.org/10.1016/j.surfcoat.2005.01.085.
10. S.-J. Park, K. Kim, J. Eden, Appl. Phys. Lett. 2005, 86, 221501. Online. Available: http://dx.doi.org/10.1063 /1.1923747.
11. J. Eden et al., J. Phys. D: Appl. Phys. 2003, 36, 2869-2877. Online. Available: http://dx.doi.org/10.1088/0022-3727/36/23/ 001.
12. M. Lu, S.-J. Park, B. Cunningham, J. Eden, J. Microelectromech. Syst. 2007, 16, 1397-1402. Online. Available: http://dx.doi.org/ 10.1109/JMEMS.2006.886034.
13. N. Bullett et al., Surf. Interface Anal. 2001, 31(11), 1074-1076. Online. Available: http://dx.doi.org/10.1002 /sia.1146.
14. S.-O. Kim, J. Eden, IEEE Photonics Technol. Lett. 2005, 17, 1543-1545. Online. Available: http://dx.doi.org/10.1109/ LPT.2005.848260.
15. U. Stöhr, P. Vulto, P. Hoppe, G. Urban, H. Reinecke, J. Micro/ Nanolith. MEMS MOEMS 2008, 7, 033 009-. Online. Available: http://dx.doi.org/10.1117/1.2964217.
16. MicroChem Corp., SU-8 data table, Internet: http://www.microchem.com/ products/su_eight.htm (accessed on 2009-01-27).
17. Dow Corning Corporation, Sylgard® 184 silicone elastomer kit, electronics product data sheet: Information about dow corning® brand silicone encapsulants, Internet: http://www.dowcorning.com/applications/ search/default.aspx?131EN (accessed 2009-01-27).