Relation between functional properties of alumina-based nanocomposites and locations of dispersed particles

Journal of the Ceramic Society of Japan

Volumn 117, Issue 1367, 2009, Pages 836-841

  Nishimura, Yoshitaka ^a,b   Aikawa, Kenichiro ^a   Choi, Seong Min ^b   Hashimoto, Shinobu ^a   Iwamoto, Yuji ^a  

^a NAGOYA INSTITUTE OF TECHNOLOGY   (Japan)

^b FUJI ELECTRIC CO   (Japan)

Author keywords

Alumina; Breakdown voltage; Dielectric constant; Nanocomposites; Nickel; Thermal conductivity; Thermal expansion

Indexed keywords

ALUMINA; ELECTRIC BREAKDOWN; FRACTURE; FRACTURE TOUGHNESS; NANOCOMPOSITES; NICKEL; PARTICLE SIZE; PERMITTIVITY; SINTERED ALUMINA; SOLVENTS; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

ALUMINA GRAINS; DISLOCATION ACTIVITY; DISPERSED PARTICLE; FUNCTIONAL PROPERTIES; MONOLITHIC ALUMINA; NANO-SIZED PARTICLES; PERCOLATION MODELS; STRENGTHENING MECHANISMS;

DIELECTRIC PROPERTIES OF SOLIDS;

EID: 67650838140     PISSN: 18820743     EISSN: 13486535     Source Type: Journal    
DOI: 10.2109/jcersj2.117.836     Document Type: Article

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