Evaluation of nano-sized nickel dispersed alumina materials

Zairyo/Journal of the Society of Materials Science, Japan

Volumn 57, Issue 10, 2008, Pages 1054-1060

  Nishimura, Yoshitaka ^a   Aikawa, Kenichiro ^b   Choi, Seong Min ^a   Hashimoto, Shinobu ^b   Awaji, Hideo ^b  

^a FUJI ELECTRIC CO   (Japan)

^b NAGOYA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Alumina; Break down voltage; Ceramics; Nanocomposites; Nickel; Thermal conductivity; Thermal expansion

Indexed keywords

ALUMINA GRAIN BOUNDARIES; ALUMINA GRAINS; ALUMINA MATERIALS; ALUMINA POWDERS; BREAK DOWN VOLTAGE; CERAMICS; ELECTRIC DEVICES; FRACTURE MODES; FRONTAL PROCESS ZONES; MONOLITHIC ALUMINAS; NI CONTENTS; PULSE ELECTRIC CURRENT SINTERING; SEM AND TEM; SOAKING METHODS; THERMO-MECHANICAL PROPERTIES;

ALUMINA; CERAMIC MATERIALS; CRYSTAL GROWTH; FRACTURE; FRACTURE TOUGHNESS; GRAIN BOUNDARIES; MECHANICAL PROPERTIES; NANOCOMPOSITES; NICKEL; NICKEL ALLOYS; POWDERS; SINTERING; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL INSULATING MATERIALS; THERMAL SPRAYING; THERMAL STRESS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES;

SINTERED ALUMINA;

EID: 58149260183     PISSN: 05145163     EISSN: None     Source Type: Journal    
DOI: 10.2472/jsms.57.1054     Document Type: Article

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