Investigation on the wettability and interfacial structure of Sn-9Zn-xAg solders on Cu substrate

Cailiao Gongcheng/Journal of Materials Engineering

Volumn , Issue 6, 2009, Pages 60-63

  Hu, Yu Hua ^a   Xue, Song Bai ^a   Chen, Wen Xue ^a   Wang, Hui ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Interface; Lead free solder; Microstructure; Wettability

Indexed keywords

BINARY ALLOYS; COPPER; INTERFACES (MATERIALS); INTERMETALLICS; MICROSTRUCTURE; SILVER COMPOUNDS; SOLDERED JOINTS; TERNARY ALLOYS; TIN ALLOYS; WETTING; ZINC ALLOYS; ZINC COMPOUNDS;

AG ADDITIONS; CU SUBSTRATE; INTERFACIAL STRUCTURES; NEEDLE-LIKE; PLANAR LAYERS; SN-9ZN SOLDER;

LEAD-FREE SOLDERS;

EID: 67650547034     PISSN: 10014381     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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