Application of Lock-In-Thermography for 3d defect localisation in complex devices

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 1041-1044

  Schmidt, Christian ^a   Altmann, Frank ^a   Naumann, Falk ^a   Lindner, Achim ^b  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^b Micronas GmbH Freiburg   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; PHASE SHIFT; REMOTE SENSING; THERMOGRAPHY (IMAGING); THERMOGRAPHY (TEMPERATURE MEASUREMENT);

3D DEFECTS; COMPLEX DEVICES; DEVICE SURFACES; ELECTRICAL DEFECTS; ELECTRICAL EXCITATIONS; INNER DEFECTS; LOCALISATION; MICROSYSTEM DEVICES; MOLD COMPOUNDS; NONDESTRUCTIVE; POINT SOURCES; RESISTIVE OPENS; SPATIAL RESOLUTIONS; THERMAL RESPONSES; THERMAL SIMULATIONS;

SURFACE DEFECTS;

EID: 58149084875     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684495     Document Type: Conference Paper

References (4)

1. Breitenstein, O. et al, "Microscopic lock in thermography investigation of leakage sites in integrated circuits", Rev. of Scientific Instruments Vol.71, (2000), pp. 4155-4160.
2. th Int. Symp. For Testing and Failure Analysis, ISTFA, Ohio, 2004, pp. 595-599.
3. Breitenstein, O. "Lock-in IR Microscopy with 1.4 μm Resolution by Using Solid Immersion Lens" Electronic device Failure Analysis, Vol. 8, (2006), pp. 1-8.
4. Breitenstein, O. et. al, "Thermal Failure Analysis by IR Lock-in Thermography", ASM Intern., 2004, pp. 398-405